asap7 docs change and hammer submodules bump
This commit is contained in:
@@ -12,7 +12,7 @@ In the Chipyard root, run:
|
||||
.. code-block:: shell
|
||||
|
||||
./scripts/init-vlsi.sh <tech-plugin-name>
|
||||
|
||||
|
||||
This will pull the Hammer & CAD tool plugin submodules, assuming the technology plugins are available on github.
|
||||
Currently only the asap7 technology plugin is available on github.
|
||||
If you have additional private technology plugins (this is a typical use-case for proprietry process technologies with require NDAs and secure servers), you can clone them directly
|
||||
@@ -40,17 +40,17 @@ Setting up the Hammer Configuration Files
|
||||
--------------------------------------------
|
||||
|
||||
The first configuration file that needs to be set up is the Hammer environment configuration file ``env.yml``. In this file you need to set the paths to the EDA tools and license servers you will be using. You do not have to fill all the fields in this configuration file, you only need to fill in the paths for the tools that you will be using.
|
||||
If you are working within a shared server farm environment with an LSF cluster setup (for example, the Berkeley Wireless Research Center), please note the additional possible environment configuration listed in the :ref:`VLSI/Basic-Flow:Advanced Environment Setup` segment of this documentation page.
|
||||
If you are working within a shared server farm environment with an LSF cluster setup (for example, the Berkeley Wireless Research Center), please note the additional possible environment configuration listed in the :ref:`VLSI/Basic-Flow:Advanced Environment Setup` segment of this documentation page.
|
||||
|
||||
Hammer relies on YAML-based configuration files. While these configuration can be consolidated within a single files (as is the case in the ASAP7 tutorial :ref:`tutorial` and the ``nangate45``
|
||||
OpenRoad example), the generally suggested way to work with an arbitrary process technology or tools plugins would be to use three configuration files, matching the three Hammer concerns - tools, tech, and design.
|
||||
OpenRoad example), the generally suggested way to work with an arbitrary process technology or tools plugins would be to use three configuration files, matching the three Hammer concerns - tools, tech, and design.
|
||||
The ``vlsi`` directory includes three such example configuration files matching the three concerns: ``example-tools.yml``, ``example-tech.yml``, and ``example-design.yml``.
|
||||
|
||||
The ``example-tools.yml`` file configures which EDA tools hammer will use. This example file uses Cadence Innovus, Genus and Voltus, Synopsys VCS, and Mentor Calibre (which are likely the tools you will use if you're working in the Berkeley Wireless Research Center). Note that tool versions are highly sensitive to the process-technology in-use. Hence, tool versions that work with one process technology may not work with another.
|
||||
|
||||
The ``example-design.yml`` file contains basic build system information (how many cores/threads to use, etc.), as well as configurations that are specific to the design we are working on such as clock signal name and frequency, power modes, floorplan, and additional constraints that we will add later on.
|
||||
|
||||
Finally, the ``example-tech.yml`` file is a template file for a process technology plugin configuration. We will copy this file, and replace its fields with the appropriate process technology details for the tech plugin that we have access to. For example, for the ``asap7`` tech plugin we will replace the <tech_name> field with "asap7", the Node size "N" with "7", and the path to the process technology files installation directory.
|
||||
Finally, the ``example-tech.yml`` file is a template file for a process technology plugin configuration. We will copy this file, and replace its fields with the appropriate process technology details for the tech plugin that we have access to. For example, for the ``asap7`` tech plugin, we will replace the <tech_name> field with "asap7" and the path to the process technology files installation directory. The technology plugin (which for ASAP7 is within Hammer) will define the technology node and other parameters.
|
||||
|
||||
We recommend copying these example configuration files and customizing them with a different name, so you can have different configuration files for different process technologies and designs (e.g. create tech-tsmintel3.yml from example-tech.yml)
|
||||
|
||||
@@ -60,10 +60,10 @@ Building the Design
|
||||
After we have set the configuration files, we will now elaborate our Chipyard Chisel design into Verilog, while also performing the required transformations in order to make the Verilog VLSI-friendly.
|
||||
Additionally, we will automatically generate another set of Hammer configuration files matching to this design, which will be used in order to configure the physical design tools.
|
||||
We will do so by calling ``make buildfile`` with appropriate Chipyard configuration variables and Hammer configuration files.
|
||||
As in the rest of the Chipyard flows, we specify our SoC configuration using the ``CONFIG`` make variable.
|
||||
As in the rest of the Chipyard flows, we specify our SoC configuration using the ``CONFIG`` make variable.
|
||||
However, unlike the rest of the Chipyard flows, in the case of physical design we might be interested in working in a hierarchical fashion and therefore we would like to work on a single module.
|
||||
Therefore, we can also specify a ``VLSI_TOP`` make variable with the same of a specific Verilog module (which should also match the name of the equivalent Chisel module) which we would like to work on.
|
||||
The makefile will automatically call tools such as Barstools and the MacroCompiler (:ref:`Tools/Barstools:barstools`) in order to make the generated Verilog more VLSI friendly.
|
||||
The makefile will automatically call tools such as Barstools and the MacroCompiler (:ref:`Tools/Barstools:barstools`) in order to make the generated Verilog more VLSI friendly.
|
||||
By default, the MacroCompiler will attempt to map memories into the SRAM options within the Hammer technology plugin. However, if you are working with a new process technology and prefer to work with flip-flop arrays, you can configure the MacroCompiler using the ``MACROCOMPILER_MODE`` make variable. For example, if your technology plugin does not have an SRAM compiler ready, you can use the ``MACROCOMPILER_MODE='--mode synflops'`` option (Note that synthesizing a design with only flipflops is very slow and will often may not meet constraints).
|
||||
|
||||
We call the ``make buildfile`` command while also specifying the name of the process technology we are working with (same ``tech_name`` for the configuration files and plugin name) and the configuration files we created. Note, in the ASAP7 tutorial ((:ref:`tutorial`)) these configuration files are merged into a single file called ``example-asap7.yml``.
|
||||
@@ -88,7 +88,7 @@ Running a basic VLSI flow using the Hammer default configurations is fairly simp
|
||||
Synthesis
|
||||
^^^^^^^^^
|
||||
|
||||
In order to run synthesis, we run ``make syn`` with the matching Make variables.
|
||||
In order to run synthesis, we run ``make syn`` with the matching Make variables.
|
||||
Post-synthesis logs and collateral will be saved in ``build/<config-name>/syn-rundir``. The raw QoR data (area, timing, gate counts, etc.) will be found in ``build/<config-name>/syn-rundir/reports``.
|
||||
|
||||
Hence, if we want to monolithically synthesize the entire SoC, the relevant command would be:
|
||||
@@ -142,7 +142,7 @@ The relevant ``make`` command would then be:
|
||||
make par CONFIG=GemminiRocketConfig VLSI_TOP=Gemmini tech_name=tsmintel3 INPUT_CONFS="example-design.yml example-tools.yml example-tech.yml"
|
||||
|
||||
Note that the width and height specification can vary widely between different modulesi and level of the module hierarchy. Make sure to set sane width and height values.
|
||||
Place-and-route generally requires more fine-grained input specifications regarding power nets, clock nets, pin assignments and floorplanning. While the template configuration files provide defaults for automatic tool defaults, these will usually result in very bad QoR, and therefore it is recommended to specify better-informed floorplans, pin assignments and power nets. For more information about cutomizing theses parameters, please refer to the :ref:`VLSI/Basic-Flow:Customizing Your VLSI Flow in Hammer` sections or to the Hammer documentation.
|
||||
Place-and-route generally requires more fine-grained input specifications regarding power nets, clock nets, pin assignments and floorplanning. While the template configuration files provide defaults for automatic tool defaults, these will usually result in very bad QoR, and therefore it is recommended to specify better-informed floorplans, pin assignments and power nets. For more information about cutomizing theses parameters, please refer to the :ref:`VLSI/Basic-Flow:Customizing Your VLSI Flow in Hammer` sections or to the Hammer documentation.
|
||||
Additionally, some Hammer process technology plugins do not provide default values for required settings such as tool paths and pin assignments (for example, ASAP7). In those cases, these constraints will need to be specified manually in the top-level configuration yml files, as is the case in the ``example-asap7.yml`` configuration file.
|
||||
|
||||
Place-and-route tools are very sensitive to process technologes (significantly more sensitive than synthesis tools), and different process technologies may work only on specific tool versions. It is recommended to check what is the appropriate tool version for the specific process technology you are working with.
|
||||
@@ -175,10 +175,10 @@ The simulation-extracted power estimation flow implicitly uses Hammer's gate-lev
|
||||
Signoff
|
||||
^^^^^^^^^
|
||||
|
||||
During chip tapeout, you will need to perform sign-off check to make sure the generated GDSII can be fabricated as intended. This is done using dedicated signoff tools that perform design rule checking (DRC) and layout versus schematic (LVS) verification.
|
||||
In most cases, placed-and-routed designs will not pass DRC and LVS on first attempts due to nuanced design rules and subtle/silent failures of the place-and-route tools. Passing DRC and LVS will often requires adding manual placement constraints to "force" the EDA tools into certain patterns.
|
||||
During chip tapeout, you will need to perform sign-off check to make sure the generated GDSII can be fabricated as intended. This is done using dedicated signoff tools that perform design rule checking (DRC) and layout versus schematic (LVS) verification.
|
||||
In most cases, placed-and-routed designs will not pass DRC and LVS on first attempts due to nuanced design rules and subtle/silent failures of the place-and-route tools. Passing DRC and LVS will often requires adding manual placement constraints to "force" the EDA tools into certain patterns.
|
||||
If you have placed-and-routed a design with the goal of getting area and power estimates, DRC and LVS are not strictly neccessary and the results will likely be quite similar. If you are intending to tapeout and fabricate a chip, DRC and LVS are mandatory and will likely requires multiple-iterations of refining manual placement constraints.
|
||||
Having a large number of DRC/LVS violations can have a significant impact on the runtime of the place-and-route procedure (since the tools will try to fix each of them several times). A large number of DRC/LVS violations may also be an indication that the design is not necessarily realistic for this particular process technology, which may have power/area implications.
|
||||
Having a large number of DRC/LVS violations can have a significant impact on the runtime of the place-and-route procedure (since the tools will try to fix each of them several times). A large number of DRC/LVS violations may also be an indication that the design is not necessarily realistic for this particular process technology, which may have power/area implications.
|
||||
|
||||
Since signoff checks are required only for a complete chip tapeout, they are currently not fully automated in Hammer, and often require some additional manual inclusion of custom Makefiles associated with specific process technologies. However, the general steps from running signoff within Hammer (under the assumption of a fully automated tech plug-in) are Make commands similar to the previous steps.
|
||||
|
||||
@@ -193,7 +193,7 @@ DRC does not emit easily audited reports, as the rule names violated can be quit
|
||||
|
||||
|
||||
In order to run LVS, the relevant ``make`` command is ``make lvs``. As in the previous stages, the make command should be accompanied by the relevant configuration Make variables:
|
||||
|
||||
|
||||
.. code-block:: shell
|
||||
|
||||
make lvs CONFIG=GemminiRocketConfig VLSI_TOP=Gemmini tech_name=tsmintel3 INPUT_CONFS="example-design.yml example-tools.yml example-tech.yml"
|
||||
@@ -228,7 +228,7 @@ If you have access to a shared LSF cluster and you would like Hammer to submit i
|
||||
Composing a Hierarchical Design
|
||||
^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^
|
||||
|
||||
For large designs, a monolithic VLSI flow may take the EDA tools a very long time to process and optimize, to the extent that it may not be feasable sometimes.
|
||||
For large designs, a monolithic VLSI flow may take the EDA tools a very long time to process and optimize, to the extent that it may not be feasable sometimes.
|
||||
Hammer supports a hierarchical physical design flow, which decomposes the design into several specified sub-components and runs the flow on each sub-components separetly. Hammer is then able to assemble these blocks together into a top-level design. This hierarchical approach speeds up the VLSI flow for large designs, especially designs in which there may me multiple instantiations of the same sub-components(since the sub-component can simply be replicated in the layout).
|
||||
While hierarchical physical design can be performed in multiple ways (top-down, bottom-up, abutment etc.), Hammer currently supports only the bottom-up approach.
|
||||
The bottom-up approach traverses a tree representing the hierarchy starting from the leaves and towards the direction of the root (the "top level"), and runs the physical design flow on each node of the hierarchy tree using the previously layed-out children nodes.
|
||||
|
||||
Reference in New Issue
Block a user